TSMC Invests in High-NA EUV Systems to Lead Next-Generation Chip Manufacturing
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TSMC is making a strategic investment in advanced high-NA EUV lithography systems from ASML, with the first EXE:5000 system expected by late 2024. This $384 million per-unit investment aims to enable 1.4nm chip production by 2027, cementing TSMC's dominance in cutting-edge semiconductor manufacturing.