Former Intel CEO Calls for Board Dismissal and Gelsinger's Return to Prevent Company Breakup
Craig Barrett, Intel's ex-CEO, strongly opposes plans to split the company and sell divisions to TSMC, arguing it would squander recent technical progress. He advocates firing the current board and reinstating Pat Gelsinger to continue the company's technological revival.
TSMC Plans Historic $100B Investment in US Semiconductor Manufacturing
Taiwan's TSMC is set to announce a groundbreaking $100 billion investment in US chip manufacturing facilities over the next four years. This landmark move, expected to be revealed by President Trump, represents one of the largest foreign investments in US manufacturing history and aims to boost domestic semiconductor production.
Intel Faces Potential Split as Broadcom and TSMC Consider Acquisition
Intel Corporation may be headed for a breakup, with Broadcom and TSMC reportedly exploring separate acquisitions of its design and manufacturing operations. The semiconductor giant's strategic shift comes amid market share losses and manufacturing challenges against key competitors.
Nvidia RTX 5090 Supply Set to Surge as Data Center Demand Falters
Industry insider reveals Nvidia is redirecting manufacturing capacity from data center GB200 chips to consumer RTX 5090 GPUs due to lower enterprise demand. The shift promises unprecedented availability of high-end graphics cards within a month, potentially disrupting AMD's RDNA 4 launch plans.
Intel Breakup Looms as TSMC and Broadcom Consider Split Acquisition
Tech giants TSMC and Broadcom are exploring potential separate acquisitions of Intel's operations, with Broadcom eyeing chip design while TSMC considers manufacturing facilities. The complex deal faces significant hurdles, including U.S. government concerns over foreign ownership of strategic semiconductor assets.
Taiwan Earthquake Forces TSMC to Halt Chip Production, Disrupting Global Supply Chain
A 6.4-magnitude earthquake in southern Taiwan forced TSMC to temporarily suspend operations at multiple fabrication facilities producing advanced chips. While most equipment resumed operation quickly, some production lines face delays due to required safety inspections and adjustments.
TSMC Achieves Taiwan-Level Quality at Arizona Fab with 4nm Chip Production
TSMC's Phoenix facility begins manufacturing cutting-edge 4nm chips, matching Taiwan's quality standards and producing components for Apple and AMD. The $65 billion investment marks a significant step in U.S. semiconductor independence, backed by substantial government support.
TSMC's Arizona Plant Expands Production with AMD and Apple Chips
TSMC's Arizona Fab 21 facility is now manufacturing Apple's A16 Bionic and AMD's Ryzen 9000-series processors using 4nm technology. The plant aims to reach full operational status by 2025 while addressing staffing challenges through both local and international recruitment.
TSMC's 3nm Chip Manufacturing Costs Hit Record $18,000 Per Wafer
Taiwan Semiconductor Manufacturing Company's 3nm wafer prices have surged to $18,000, more than triple the cost from a decade ago. The dramatic increase reflects growing manufacturing complexity and impacts major tech companies like Apple, while highlighting broader semiconductor industry challenges.
TSMC Navigates Cultural Divide as Arizona Plant Relies Heavily on Taiwanese Expertise
TSMC's Arizona semiconductor facility faces staffing challenges with half its 2,200-strong workforce from Taiwan, sparking controversy over local hiring promises. The company plans to increase US worker representation while expanding operations, though advanced chip production may require continued reliance on specialized Taiwanese expertise.